Automatic Multi-Tank Ultrasonic Cleaning System for Semiconductor Wafer

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Product Description

📋 Basic Information
Model NO.
JTM-10720AD
Application
Semiconductor Industry
Cleaning Media
Wet Cleaning
Automation
Automatic
Cleaning Precision
Precision Industrial Cleaning
Control
PLC
Principle
Physical Cleaning
Certification
CE, RoHS
Condition
New
Customized
Customized
Feature
High Efficiency
Ultrasonic Frequency
40kHz
Heating Power
100kw
Cleaning Temp.
Normal Temperature-100℃
Transport Package
Wooden Case, Wooden Frame
Specification
12M*2M*2.6M
⚙️ Product Description
JTM-10720AD Automatic Semiconductor Wafer Cleaning System is a high-end precision cleaning equipment developed specifically for the semiconductor industry, integrating advanced ultrasonic cleaning technology, megasonic cleaning module, and full-automatic conveying system. It is engineered to meet the stringent cleanliness requirements of semiconductor wafer manufacturing effectively removing particle contaminants, organic residues, metal ions, and photoresist residues on the wafer surface and edge.
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Dual Ultrasonic Cleaning Technology

Integrates high-frequency ultrasonic cleaning and megasonic cleaning to achieve multi-stage precision cleaning. High-frequency ultrasonic waves efficiently remove submicron particles, while megasonic waves penetrate ultra-thin oxide layers, ensuring the wafer surface meets Grade 10 cleanroom standards.

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Fully Automatic Integrated Operation

Equipped with a PLC control system and touch screen interface, realizing full automation of loading, conveying, cleaning, rinsing, drying, and unloading. The servo-driven system ensures stable transfer and supports online connection with production lines to avoid secondary contamination.

🖼️ Product Display
Frequently Asked Questions
What industries is the JTM-10720AD system designed for?
This system is specifically engineered for the semiconductor industry, ideal for wafer pre-processing, post-etching, and post-polishing cleaning processes in semiconductor fabs.
What cleaning technologies does this equipment use?
It integrates dual technology: high-frequency ultrasonic cleaning for submicron particles and megasonic cleaning for removing organic residues and metal ions.
Is the wafer cleaning process fully automated?
Yes, the system features a PLC control system that manages loading, conveying, cleaning, rinsing, drying, and unloading automatically.
What level of cleanliness can this system achieve?
The system is designed to meet Grade 10 cleanroom standards, ensuring thorough removal of contaminants without damaging the wafer surface.
Can the conveying speed be adjusted?
Yes, the servo-driven conveying system allows for adjustable speeds to match different production rhythms and requirements.
What is the maximum cleaning temperature?
The system supports a cleaning temperature range from normal room temperature up to 100℃.

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